High thermal conductivity epoxy structural adhesive 9150
Luxbond 9150 is a one-component high thermal conductivity epoxy resin adhesive. This product can provide excellent mechanical strength and bonding performance with the advantages of high thermal conductivity, high strength, high viscosity, thixotropy, etc. It can be cured quickly under medium and high temperature conditions, and has good resistance and solvent resistance. It is widely used for structural thermal bonding between heating components and heat sinks, and is especially suitable for the bonding of components with high temperature resistance requirements.
一. Technical Parameters
Model: Luxbond 9150
Appearance: Grey
Chemical Characteristics: Epoxy resin
Viscosity(25℃): Thixotropic paste
Hardness Shore D: 88±5
Specific gravity @25°C: 3.2±.1
Elongation at break %: 1.0
Thermal conductivity W/m·K: 5.0
Shear strength (Polished aluminum MPa: 8, (Sandblasted aluminum) MPa: 10, (Sandblasted steel) MPa: 12
Tens strength N/mm2: ≥15
Working temperature °C: -40~150
Insulation strength KV/mm: >15
二. Product Features
1. Single-component thixotropic paste
2. Mechanical impact resistance
3. Excellent heat resistance and environmental aging resistance
4. Complies RoHS, REACH, and free of halogens
5. Thermal conductivity 5.0W/m·K
三. Typical Applications
Elect and electronic components, heat dissipation modules, devices.