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Heat conduction pad UTP100-H20-9
Luxbond UTP100-H20-9 is a thermally conductive interface material processed by special technology with glass fiber as reinforcement. This product is self-adhesive on one side, puncture-resistant, very soft, and has excellent compressibility, which can be closely attached to electronic components to effectively the thermal resistance at the interface and perform extremely well in thermal conductivity. It can operate stably within the temperature range of -40~150℃ for a long time and at the same time meets the UL94V-0 flammability grade.
一. Technical Parameters
Model: Luxbond UTP100-H20-9
Appearance: Brownish red   white
ickness (mm): 0.5~12.0
Specific gravity (@25°C): 1.9±0.1
Elongation % 60
Tensile strength (MPa): 2.5
Temperature resistance range (°C): -40~150
Hardness (Sh OO): 20±5
Flame retardant (UL94): V-0
Dielectric constant: 5.3
Dielectric (KV/mm): ≥10.0
Thermal conductivity (W/m·K): 1.0±0.1
二. Product
1. Single-sided self-adhesive, super soft, anti-puncture
2. Compressibility, low thermal resistance, excellent heat conductivity
3. Fl retardant conforming to UL94-V0
4. Mainly used for cooling devices to the chassis or frame directly, flat display, power conversion equipment, LED equipment, MOS tubes with high electrical insulation requirements, etc.
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