Luxbond 919 is a low-halide epoxy-based liquid filling material for CSP, BGA, and uB assembly. This filling material has a fast cure at high temperatures, with reliability comparable to that of connections made with thermosetting resins, and it has excellent repairab as an added benefit. The cured filling material can be removed at any time if necessary, and the product is easy to dispense and can quickly pass through gaps such as 1 microns. Used for CSP, BGA, and uBGA assembly. This filling material allows for the repair of defective connections to improve the yield of the assembly process. product is used in electronic products that are prone to impact, such as mobile phones, laptops, etc., to improve the reliability of CSP and BGA assembly.