一. Technical Parameters
Model: Luxbond 9120
Appearance: Black
Chemical Type: Modified Epoxy Res
Hardness Shore D: 85 ± 5
Viscosity (@25°C, mPa·s): 25000 ± 250
Specific Gravity (@25°C): 1.9 ± 0.1
Shrinkage %: <0.2
Glass Transition TemperatureC: 75
Insulation Strength KV/mm: 18
二. Product Features
1. Single-component, low-temperature rapid curingoxy resin adhesive
2. Excellent mechanical strength and bonding performance
3. High bonding strength, low coefficient of thermal expansion, low stress
4. Water resistance, solvent resistance
. Mainly used for the packaging and fixation of electronic components; especially suitable for temperature-sensitive components and process technology.