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Thermal Conductive Silicone Pads TP200-H25-S
Luxbond TP200-H25-S is a high-performance thermal interface material with excellent thermal conductivity. This product is self-hesive, super soft, and exhibits low thermal resistance and good electrical insulation characteristics under low compression force when used with electronic components. It can operate stably within the temperature range of -0~150℃ and meets the UL94 V-0 flammability rating requirement.
一. Technical Parameters
Model: Luxbond TP200-H25-S
Appearance: Grey
Thickness (mm):1.0~10.0
Specific Gravity (@25°C): 2.8±0.1
Tensile Elongation %: 100
Temperature Resistance Range (°C): -40~150
Hardness (Shore OO): 25±5
Flameardant (UL94): V-0
Dielectric Constant: 7.0
Dielectric Strength (KV/mm): ≥6.0Thermal Conductivity (W/m·K): 2.0±0.1
二. Product Features
1. Self-adhesive, ultra-soft2. Low thermal resistance, excellent electrical insulation performance
3. Complies with UL94-V0
4. Mainly used for computer cooling modules, automotive engine control, flat panel displays, power conversion devices, LED lighting devices, power modules, etc.
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