ITW techspray 1571, as a highly effective and non flammable water-based cleaning agent, can directly replace IPA and other common solvents used in batch cleaning system without rinsing. Its unique organic solvent and deionized water mixing formula design can effectively remove the vast majority of solder paste and glue residues. If the pollution degree is light, it does not need 100% cleaning power of the original solution, and the original solution can be diluted by deionized water to reduce the cleaning cost. ITW techspray 1571 does not contain free ions and will not leave any harmful substances that may change the subsequent process window or cause circuit board failure.